Nintendo plans Wii console this summer to upgrade the hardware configuration, to upgrade both CPU and GPU to 65nm manufacturing. Provided by IBM for the Wii’s PowerPC processors, as well as AMD/ ATI provided “Hollywood” GPU are 90nm manufacturing process. Upgrade at 65nm, the chips is reduce power consumption. Therefore, the affirmed new Wii console will be modified thermal design, by deleting all the fans, be converted to all passive cooling. In addition, because of flash memory prices have fallen sharply, and Nintendo Wii also probably doubled the built-in 512MB flash memory. And host of other hardware form and design of architecture will not change.

IBM and AMD because of the other chip products are already being used in even more advanced 65nm process, Nintendo’s Wii hardware replacement program should be technically not meet too much difficulty. However, because of Nintendo Wii has never been formally introduced the hardware. Therefore, upgrade will not have any official information, only to be someone this summer to buy a new machine can be confirmed after the dismantling.